Influence of underlying interlevel dielectric films on...

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures 2000 Vol. 18; Iss. 6

Influence of underlying interlevel dielectric films on extrusion formation in aluminum interconnects

Chen, Fen, Li, Baozhen, Sullivan, Timothy D., Gonzalez, Clara L., Muzzy, Christopher D., Lee, H. K., Levy, Mark D., Dashiell, Michael W., Kolodzey, James
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Volume:
18
Year:
2000
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.1319691
File:
PDF, 530 KB
english, 2000
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