Thermally reflowed ZEP 520A for gate length reduction and...

Thermally reflowed ZEP 520A for gate length reduction and profile rounding in T-gate fabrication

Downey, Brian P., Meyer, David J., Bass, Robert, Katzer, D. Scott, Binari, Steven C.
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Volume:
30
Year:
2012
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.4740502
File:
PDF, 1.64 MB
english, 2012
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