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SPIE Proceedings [SPIE SPIE Sensing Technology + Applications - Baltimore, Maryland, USA (Monday 5 May 2014)] Image Sensing Technologies: Materials, Devices, Systems, and Applications - Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications
Dhar, Nibir K., Dutta, Achyut K., Lueck, Matthew, Lannon, John, Gregory, Chris, Malta, Dean, Huffman, A., Temple, Dorota S.Volume:
9100
Year:
2014
Language:
english
DOI:
10.1117/12.2058166
File:
PDF, 631 KB
english, 2014