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STEADY STATE AND TRANSIENT THERMAL ANALYSIS OF CHIP SCALE PACKAGES
CHAMBERS, BEN, LEE, TIEN-YU TOM, BLOOD, WILLIAMVolume:
9
Language:
english
Journal:
Journal of Electronics Manufacturing
DOI:
10.1142/s0960313199000064
Date:
June, 1999
File:
PDF, 207 KB
english, 1999