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Electromigration in Nanometer Al-Cu Interconnect Lines
Pang, Xun, Kriman, Alfred M., Bernstein, Gary H.Volume:
149
Year:
2002
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1430229
File:
PDF, 1.20 MB
english, 2002