Superpolishing for Planarizing Copper Damascene Interconnects
Chang, Shih-Chieh, Shieh, Jia-Min, Dai, Bau-Tong, Feng, Ming-Shiann, Li, Ying-Hao, Shih, C. H., Tsai, M. H., Shue, S. L., Liang, R. S., Wang, Ying-LangVolume:
6
Year:
2003
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.1565853
File:
PDF, 256 KB
english, 2003