Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate, and Temperature in Copper CMP
Sampurno, Yasa, Borucki, Leonard, Philipossian, AraVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2048207
File:
PDF, 723 KB
english, 2005