[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Moisture Resistant Nano Liter Packages Using Metallic Seal Wafer Bonding
Reinert, Wolfgang H., Merz, Peter, Schwarzelbach, OliverVolume:
3
Year:
2006
Language:
english
DOI:
10.1149/1.2357087
File:
PDF, 127 KB
english, 2006