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[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - High Density Copper Bump Technology Integrated With Wafer Level Package
Zeng, Xiang, Chang-Chien, Patty, Cheung, Chi, Akerling, G, Johnson, Rosie, Chung, T., Hennig, KellyVolume:
16
Year:
2008
Language:
english
DOI:
10.1149/1.2983154
File:
PDF, 996 KB
english, 2008