[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October...

  • Main
  • [ECS 214th ECS Meeting - Honolulu, HI...

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - High Density Copper Bump Technology Integrated With Wafer Level Package

Zeng, Xiang, Chang-Chien, Patty, Cheung, Chi, Akerling, G, Johnson, Rosie, Chung, T., Hennig, Kelly
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
16
Year:
2008
Language:
english
DOI:
10.1149/1.2983154
File:
PDF, 996 KB
english, 2008
Conversion to is in progress
Conversion to is failed