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Effect of pH on Material Removal Rate of Cu in Abrasive-Free Polishing
Wei, Zhang, Xinchun, Lu, Yuhong, Liu, Guoshun, Pan, Jianbin, LuoVolume:
156
Year:
2009
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3055985
File:
PDF, 614 KB
english, 2009