[ECS 215th ECS Meeting - San Francisco, CA (May 24 - May 29, 2009)] ECS Transactions - Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper
Wafula, Fred, Liu, Yihua, Yin, Liang, Bliznakov, Stoyan, Borgesen, Peter, Cotts, Eric, Dimitrov, NikolayYear:
2009
Language:
english
DOI:
10.1149/1.3246597
File:
PDF, 1.60 MB
english, 2009