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ECS Transactions [ECS 217th ECS Meeting - Vancouver, Canada (April 25 - April 30, 2010)] - (Invited) PE-TEOS Wafer Bonding Enhancement at Low Temperature with a High-k Dielectric Capping Layer
Tan, Chuan Seng, Chong, Gang YihYear:
2010
Language:
english
DOI:
10.1149/1.3372603
File:
PDF, 1005 KB
english, 2010