First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating
Wang, Xu, Yang, Zhifeng, Li, Na, Liu, Zonghuai, Yang, Zupei, Wang, ZenglinVolume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3479191
File:
PDF, 520 KB
english, 2010