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Texture and Grain Size Investigation in the Copper Plated Through-Silicon via for Three-Dimensional Chip Stacking Using Electron Backscattering Diffraction
Kadota, Hiroyuki, Kanno, Ryuichi, Ito, Masahiko, Onuki, JinVolume:
14
Year:
2011
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3555448
File:
PDF, 2.08 MB
english, 2011