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ECS Transactions [ECS China Semiconductor Technology International Conference 2012 (CSTIC 2012) - Shanghai, China (March 18 - March 19, 2012)] - Wafer Bonding for Backside Illuminated Image Sensors
Matthias, Thorsten, Uhrmann, Thomas, Dragoi, Viorel, Wagenleitner, Thomas, Lindner, PaulYear:
2012
Language:
english
DOI:
10.1149/1.3694458
File:
PDF, 696 KB
english, 2012