Electrically Conductive Adhesives for Electronic Packaging...

Journal of Adhesion Science and Technology 2008 / 01 Vol. 22; Iss. 8-9

Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

Matienzo, L. J., Das, R. N., Egitto, F. D.
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Volume:
22
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108x305444
Date:
January, 2008
File:
PDF, 2.11 MB
english, 2008
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