Application of the narrow spectral range InAs-FPA-based IR camera for the investigation of the interface voids in silicon wafer bonding
B.G Vainer, G.N Kamaev, G.L KurishevVolume:
210
Year:
2000
Language:
english
Pages:
5
DOI:
10.1016/s0022-0248(99)00709-5
File:
PDF, 621 KB
english, 2000