Microstructure, electrical properties, and thermal...

Journal of Materials Research 1999 / 3 Vol. 14; Iss. 3

Microstructure, electrical properties, and thermal stability of Ti-based ohmic contacts to n-GaN

Smith, L. L., Davis, R. F., Liu, R-J., Kim, M. J., Carpenter, R. W.
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Volume:
14
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.1999.0137
Date:
March, 1999
File:
PDF, 478 KB
english, 1999
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