Microstructure and adhesion properties of Sn–0.7Cu/Cu...

Journal of Materials Research 2002 / 4 Vol. 17; Iss. 4

Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints

Bae, Kyoo-Sik, Kim, Si-Jung
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Volume:
17
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2002.0108
Date:
April, 2002
File:
PDF, 464 KB
english, 2002
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