Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints
Chromik, R. R., Vinci, R. P., Allen, S. L., Notis, M. R.Volume:
18
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2003.0314
Date:
September, 2003
File:
PDF, 256 KB
english, 2003