Effect of Cu addition on interfacial reactions between...

Journal of Materials Research 2007 / 10 Vol. 22; Iss. 10

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Yen, Yee-wen, Liou, Wei-kai
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Volume:
22
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2007.0339
Date:
October, 2007
File:
PDF, 516 KB
english, 2007
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