Initial interfacial reaction layers formed in Sn–3.5Ag...

Journal of Materials Research 2008 / 8 Vol. 23; Iss. 8

Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system

Kang, Han-Byul, Lee, Jae-Wook, Bae, Jee-Hwan, Park, Min-Ho, Yoon, Jeong-Won, Jung, Seung-Boo, Ju, Jae-Seon, Yang, Cheol-Woong
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Volume:
23
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2008.0266
Date:
August, 2008
File:
PDF, 653 KB
english, 2008
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