Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low- k dielectrics using a late porogen removal scheme
Che, Mu-Lung, Huang, Cheng-Ying, Choang, Shindy, Chen, Yu-Hen, Leu, JihperngVolume:
25
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2010.0136
Date:
June, 2010
File:
PDF, 812 KB
english, 2010