Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by...

Journal of Materials Research 2010 / 6 Vol. 25; Iss. 6

Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current

Liu, Haiyan, Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, Shang, Jian Ku
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
25
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2010.0143
Date:
June, 2010
File:
PDF, 765 KB
english, 2010
Conversion to is in progress
Conversion to is failed