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Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging
Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, JieVolume:
26
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2011.179
Date:
June, 2011
File:
PDF, 306 KB
english, 2011