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Influence of indium addition on electromigration behavior of solder joint
Lee, Kiju, Kim, Keun-Soo, Suganuma, KatsuakiVolume:
26
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2011.283
Date:
October, 2011
File:
PDF, 567 KB
english, 2011