Magnetic-field induced anisotropy in electromigration...

Journal of Materials Research 2015 / 04 Vol. 30; Iss. 8

Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

Chen, Jian-Qiang, Guo, Jing-Dong, Ma, Hui-Cai, Liu, Kai-Lang, Zhu, Qing-sheng, Shang, Jian Ku
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Volume:
30
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2015.85
Date:
April, 2015
File:
PDF, 446 KB
english, 2015
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