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Silicon Based System-in-Package : Breakthroughs in Miniaturization and ‘Nano’-integration Supported by Very High Quality Passives and System Level Design Tools
Murray, Franck, LeCornec, François, Bardy, Serge, Bunel, Catherine, Verhoeven, Jan, van den Heuvel, F.C.M., Klootwijk, J.H., Roozeboom, FredVolume:
969
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-0969-w02-01-v02-01
Date:
January, 2006
File:
PDF, 444 KB
english, 2006