A Novel Method to Dicing Anodically Bonded Silicon Glass...

Applied Mechanics and Materials 2014 / 2 Vol. 511-512

A Novel Method to Dicing Anodically Bonded Silicon Glass MEMS Wafers Based on UV Laser Technique

Jing, Zhi Sheng, Zhou, Ze Long, Mei, Chen, Su, Xiang Yong, Yang, Zhuo, Tao, Yi
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Volume:
511-512
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/amm.511-512.3
Date:
February, 2014
File:
PDF, 758 KB
english, 2014
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