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Strength Analysis of Epoxy Molding Compound Module Using Automated FEA System
Lee, Joon Seong, Hong, Hee Rok, Jo, Gye Hyun, Park, Dong KeunVolume:
670-671
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/amm.670-671.852
Date:
October, 2014
File:
PDF, 445 KB
english, 2014