![](/img/cover-not-exists.png)
Influence of Wafer Grinding and Etching Techniques on the Fracture Strength of Thin Silicon Substrates
Landesberger, Christof, Paschke, Christoph, Bock, KarlheinzVolume:
325
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.325.659
Date:
August, 2011
File:
PDF, 2.26 MB
english, 2011