Influence of Wafer Grinding and Etching Techniques on the...

Influence of Wafer Grinding and Etching Techniques on the Fracture Strength of Thin Silicon Substrates

Landesberger, Christof, Paschke, Christoph, Bock, Karlheinz
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Volume:
325
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.325.659
Date:
August, 2011
File:
PDF, 2.26 MB
english, 2011
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