Two Temperature Model Numerical Simulation and Analysis of...

Two Temperature Model Numerical Simulation and Analysis of Thermal Transport Process in Copper Film

Zeng, Fan Da, Han, Ya Ping, Wang, Jin Xin, Wang, Shao Ze
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Volume:
750-752
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.750-752.2271
Date:
August, 2013
File:
PDF, 297 KB
english, 2013
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