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Two Temperature Model Numerical Simulation and Analysis of Thermal Transport Process in Copper Film
Zeng, Fan Da, Han, Ya Ping, Wang, Jin Xin, Wang, Shao ZeVolume:
750-752
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.750-752.2271
Date:
August, 2013
File:
PDF, 297 KB
english, 2013