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Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Wade, Noboru, Akuzawa, T., Kunii, J., Miyahara, K.Volume:
171-174
Year:
2000
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.171-174.663
File:
PDF, 509 KB
2000