High-Precision Low-Damage Grinding of Polycrystalline SiC

Key Engineering Materials 2003 Vol. 238-239

High-Precision Low-Damage Grinding of Polycrystalline SiC

Yin, L., Vancoille, E.Y.J., Lee, L.C., Liu, Y.C., Huang, H., Ramesh, K.
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Volume:
238-239
Year:
2003
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.238-239.59
File:
PDF, 551 KB
english, 2003
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