Reliability Estimation of Solder Joint by Using the Failure Probability Models
Lee, Ouk Sub, Hur, Man Jae, Hawong, Jai Sug, Myoung, No Hoon, Kim, Dong HyeokVolume:
326-328
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.326-328.621
File:
PDF, 296 KB
english, 2006