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Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending
Kakuno, Hatsuki, Oda, Kazuhiro, Morisaki, TetsuyaVolume:
417-418
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.417-418.153
Date:
October, 2009
File:
PDF, 236 KB
english, 2009