![](/img/cover-not-exists.png)
Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes
Saiki, Naoya, Inaba, Kazuaki, Kishimoto, Kikuo, Seno, Hideo, Takahashi, KazuhiroVolume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.462-463.807
Date:
January, 2011
File:
PDF, 462 KB
english, 2011