Development of Low Cost Sn-0.7Cu Base Composite Solder for...

Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application

Mahim, Zawawi, Saud, Norainiza, Razak, Nurul Razliana Abdul
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Volume:
803
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.803.239
Date:
August, 2014
File:
PDF, 353 KB
english, 2014
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