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Texture and Mechanical Properties of Electrodeposited Copper Thin Films
Bunsch, Adam, Skrzypek, S.J., Kowalska, J., Ratuszek, Wiktoria, Rakowski, W.Volume:
163
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/ssp.163.141
Date:
June, 2010
File:
PDF, 501 KB
english, 2010