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Room-temperature direct bonding of germanium wafers by surface-activated bonding method
Higurashi, Eiji, Sasaki, Yuta, Kurayama, Ryuji, Suga, Tadatomo, Doi, Yasuo, Sawayama, Yoshihiro, Hosako, IwaoVolume:
54
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/jjap.54.030213
Date:
March, 2015
File:
PDF, 3.29 MB
english, 2015