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Influence of Chemical Pretreatment of Epoxy Polymers on the Adhesion Strength of Electrochemically Deposited Cu for Use in Electronic Interconnections
Siau, Sam, Vervaet, Alfons, Schacht, Etienne, Van Calster, AndreVolume:
151
Year:
2004
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1639159
File:
PDF, 807 KB
english, 2004