Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
Dixit, Pradeep, Tan, Chee Wee, Xu, Luhua, Lin, Nay, Miao, Jianmin, Pang, John H L, Backus, Petra, Preisser, RobertVolume:
17
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/17/5/030
Date:
May, 2007
File:
PDF, 1.14 MB
english, 2007