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ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and 1/2 Pitch Lines: From Coupon to Full-Wafer Experiments
Armini, Silvia, Demuynck, Steven, El-mekki, Zaid, Swerts, Johan, Nagar, Magi, Radisic, Alex, Heylen, Nancy, Beyer, Gerald, Leunissen, Leonardus, Vereecken, PhilippeYear:
2011
Language:
english
DOI:
10.1149/1.3568853
File:
PDF, 3.62 MB
english, 2011