Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging
Gomez, Juan, Lin, Minghui, Basaran, CemalVolume:
2
Language:
english
Journal:
Multidiscipline Modeling in Materials and Structures
DOI:
10.1163/157361106777641387
Date:
March, 2006
File:
PDF, 229 KB
english, 2006