Stacked Modular Package

IEEE Transactions on Advanced Packaging 2004 / 08 Vol. 27; Iss. 3

Stacked Modular Package

Pienimaa, S.K., Miettinen, J., Ristolainen, E.
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2004.831860
Date:
August, 2004
File:
PDF, 1.20 MB
english, 2004
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