Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review
Leong Gan, Chong, Classe, Francis, Lee Chan, Bak, Hashim, UdaVolume:
31
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/mi-07-2013-0036
Date:
April, 2014
File:
PDF, 213 KB
english, 2014