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Dynamic reliability approach of chip scale package assembly under vibration environment
Yang, Ping, Tang, Xiusheng, Liu, Yu, Wang, Shuting, Yang, JianmingVolume:
31
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/mi-11-2013-0061
Date:
April, 2014
File:
PDF, 224 KB
english, 2014