![](/img/cover-not-exists.png)
[IEEE 2015 20th Asia and South Pacific Design Automation Conference (ASP-DAC) - Chiba, Japan (2015.1.19-2015.1.22)] The 20th Asia and South Pacific Design Automation Conference - An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST
Liang-Che Li,, Wen-Hsuan Hsu,, Kuen-Jong Lee,, Chun-Lung Hsu,Year:
2015
Language:
english
DOI:
10.1109/aspdac.2015.7059059
File:
PDF, 930 KB
english, 2015