![](/img/cover-not-exists.png)
[IEEE 2014 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Chengdu, China (2014.6.18-2014.6.20)] 2014 IEEE International Conference on Electron Devices and Solid-State Circuits - Improving the accuracy of module based thermal modeling method for VLSI circuits design
Wang, Hai, Ming Zhang,, Chi Zhang,, He Tang,, Xiaowei Wang,Year:
2014
Language:
english
DOI:
10.1109/edssc.2014.7061128
File:
PDF, 352 KB
english, 2014