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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Experimental study for method to measure terminal part temperature of micro-electronic devices using infrared thermograph and image processing
Hirasawa, Koichi, Aruga, Yoshinori, Ohhashi, Yasushi, Tomimura, ToshioYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111039
File:
PDF, 655 KB
english, 2015